{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462497","patent":{"patent_number":"US-11462497","title":"Semiconductor device including coupled bond pads having differing numbers of pad legs","assignee":null,"inventors":[],"filing_date":"2021-02-12T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device including an integrated module formed of a first semiconductor die coupled to a second semiconductor die. Each of the first and second semiconductor dies includes a number of bond pads, which are bonded to each other to form the integrated module. Each bond pad may be divided into a number of discrete pad legs. While the overall footprint of each bond pad on the first and second semiconductor dies may be the same, the bond pads on one of the dies may have a larger number of pad legs."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including coupled bond pads having differing numbers of pad legs","description":"A semiconductor device including an integrated module formed of a first semiconductor die coupled to a second semiconductor die. Each of the first and second semiconductor dies includes a number of bo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462497","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462497","citation_suggestion":"Patentable. \"Semiconductor device including coupled bond pads having differing numbers of pad legs\" (US-11462497). https://patentable.app/patents/US-11462497","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462497","json":"https://patentable.app/api/llm-context/US-11462497","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:24:00.179Z"}