{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462509","patent":{"patent_number":"US-11462509","title":"Package structure with electronic device in cavity substrate and method for forming the same","assignee":null,"inventors":[],"filing_date":"2020-07-01T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure is provided. The package structure includes a substrate having a first surface and a second surface opposite the first surface. The substrate includes a cavity extending from the second surface toward the first surface, and thermal vias extending from a bottom surface of the cavity to the first surface. The package structure also includes at least one electronic device formed in the cavity and thermally coupled to the thermal vias. In addition, the package structure includes an insulating layer formed over the second surface and covering the first electronic device. The insulating layer includes a redistribution layer (RDL) structure electrically connected to the electronic device. The package structure also includes an encapsulating material formed in the cavity, extending along sidewalls of the electronic device and between the electronic device and the insulating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure with electronic device in cavity substrate and method for forming the same","description":"A package structure is provided. The package structure includes a substrate having a first surface and a second surface opposite the first surface. The substrate includes a cavity extending from the s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462509","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462509","citation_suggestion":"Patentable. \"Package structure with electronic device in cavity substrate and method for forming the same\" (US-11462509). https://patentable.app/patents/US-11462509","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462509","json":"https://patentable.app/api/llm-context/US-11462509","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:26:13.828Z"}