{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462511","patent":{"patent_number":"US-11462511","title":"Semiconductor package including stacked semiconductor chips","assignee":null,"inventors":[],"filing_date":"2020-10-14T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor package includes a sub semiconductor package disposed over a substrate. The sub semiconductor package includes a sub semiconductor chip with chip pads on its upper surface, a sub molding layer that surrounds the sub semiconductor chip, and a redistribution conductive layer that is connected to each of the chip pads and extends over an upper surface of the sub molding layer. The redistribution conductive layer includes a signal redistribution conductive layer that extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion and a power redistribution conductive layer with a length that is shorter than a length of the signal redistribution conductive layer. The semiconductor package also includes a sub signal interconnector, sub power interconnector, and at least one main semiconductor chip formed over the sub semiconductor package and electrically connected to the substrate or the sub semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including stacked semiconductor chips","description":"A semiconductor package includes a sub semiconductor package disposed over a substrate. The sub semiconductor package includes a sub semiconductor chip with chip pads on its upper surface, a sub moldi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462511","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462511","citation_suggestion":"Patentable. \"Semiconductor package including stacked semiconductor chips\" (US-11462511). https://patentable.app/patents/US-11462511","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462511","json":"https://patentable.app/api/llm-context/US-11462511","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:34:54.754Z"}