{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462513","patent":{"patent_number":"US-11462513","title":"Chip bonding alignment structure, chip bonding structure and methods for fabricating the same","assignee":null,"inventors":[],"filing_date":"2021-02-22T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A chip bonding alignment structure includes a semiconductor chip, a metal layer, an etching stop layer, at least one metal bump, a dielectric barrier layer, a silicon oxide layer, and a silicon carbonitride layer. The metal layer is disposed on a bonding surface of the semiconductor chip and has a metal alignment pattern. The etching stop layer covers the bonding surface and the metal layer. The metal bump extends upward from the metal layer and penetrates through the etching stop layer. The dielectric barrier layer covers the etching stop layer and the metal bump. The silicon oxide layer covers the dielectric barrier layer. The silicon carbonitride layer covers the silicon oxide layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip bonding alignment structure, chip bonding structure and methods for fabricating the same","description":"A chip bonding alignment structure includes a semiconductor chip, a metal layer, an etching stop layer, at least one metal bump, a dielectric barrier layer, a silicon oxide layer, and a silicon carbon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462513","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462513","citation_suggestion":"Patentable. \"Chip bonding alignment structure, chip bonding structure and methods for fabricating the same\" (US-11462513). https://patentable.app/patents/US-11462513","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462513","json":"https://patentable.app/api/llm-context/US-11462513","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:57:42.329Z"}