{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462516","patent":{"patent_number":"US-11462516","title":"Method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2021-04-01T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An object of the present disclosure is to provide a method of manufacturing a semiconductor device capable of suppressing an electrostatic breakdown in a configuration including a semiconductor element with a sense cell part. A method of manufacturing a semiconductor device according to the present disclosure includes: bonding each of semiconductor elements 1 and a relay substrate on a conductor plate; connecting each of signal pads of each of the semiconductor elements and each of control pads of the relay substrate by a wire; bonding a first electrode material on each of the semiconductor elements; bonding a second electrode material on the relay substrate; sealing the conductor plate, each of the semiconductor elements, the relay substrate, the first electrode material, and the second electrode material by a sealing resin; and grinding the sealing resin and removing the shorting part to expose part of the second electrode material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor device","description":"An object of the present disclosure is to provide a method of manufacturing a semiconductor device capable of suppressing an electrostatic breakdown in a configuration including a semiconductor elemen","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462516","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462516","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor device\" (US-11462516). https://patentable.app/patents/US-11462516","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462516","json":"https://patentable.app/api/llm-context/US-11462516","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:45:25.909Z"}