{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462667","patent":{"patent_number":"US-11462667","title":"Electronic component, method of manufacturing electronic component, and electronic device","assignee":null,"inventors":[],"filing_date":"2019-03-27T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An electronic component includes a wiring substrate having a first surface, a second surface opposite to the first surface, a side surface connected to the first surface and the second surface, and a groove portion formed in the side surface and extending from the first surface to the second surface. The electronic component further includes a first electrode disposed on the first surface along the first surface, a second electrode disposed on the second surface along the second surface, a connection conductor disposed over an entire inner surface of the groove portion and electrically connected to the first electrode and the second electrode, an electronic element disposed on the first surface and electrically connected to the first electrode, and a resin portion disposed on the first surface. All edges of the second electrode are spaced apart from the side surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component, method of manufacturing electronic component, and electronic device","description":"An electronic component includes a wiring substrate having a first surface, a second surface opposite to the first surface, a side surface connected to the first surface and the second surface, and a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462667","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462667","citation_suggestion":"Patentable. \"Electronic component, method of manufacturing electronic component, and electronic device\" (US-11462667). https://patentable.app/patents/US-11462667","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462667","json":"https://patentable.app/api/llm-context/US-11462667","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:01:25.388Z"}