{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11462668","patent":{"patent_number":"US-11462668","title":"Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device","assignee":null,"inventors":[],"filing_date":"2020-11-30T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A stacked semiconductor device encompasses a mother-plate having a mounting-main surface and a bottom-main surface, an onboard-element having a connection face facing to the mounting-main surface, a parent bump provided on the mother-plate, having a mother-site wall made of a layer of conductor, mother-site wall is perpendicular to the mounting-main surface, and a repair bump provided on the onboard-element at a side of the connection face, having a repair-site wall made of a layer of conductor having different hardness from the mother-site wall, the repair-site wall is perpendicular to the connection face, configure to bite each other with the parent bump at an intersection between the mother-site wall and the repair-site wall conductor."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device","description":"A stacked semiconductor device encompasses a mother-plate having a mounting-main surface and a bottom-main surface, an onboard-element having a connection face facing to the mounting-main surface, a p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11462668","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11462668","citation_suggestion":"Patentable. \"Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device\" (US-11462668). https://patentable.app/patents/US-11462668","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11462668","json":"https://patentable.app/api/llm-context/US-11462668","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:06:02.566Z"}