{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11463524","patent":{"patent_number":"US-11463524","title":"Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem","assignee":null,"inventors":[],"filing_date":"2021-06-15T00:00:00.000Z","publication_date":"2022-10-04T00:00:00.000Z","cpc_codes":["H04L","G06F","G06F","G06F","G06F","H04B","G16Y","H04L","H04W"],"num_claims":16,"abstract":"A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) die element and a reconfigurable die element capable of serving as storage memory or as configuration memory based on configuration information; and a processor coupled to the substrate and configured to cooperate with the die stack for processing data; and a processor-independent connectivity unit coupled to the reconfigurable processor unit and including an antenna; a radio-frequency chip (RFIC) coupled to the antenna and configured to receive incoming signals and transmit outgoing signals over the antenna; circuitry configured to translate the incoming signals to incoming data or transmit the outgoing data to outgoing signals; and a system interface configured to transmit the incoming data to the reconfigurable processor unit for processing, and configured to receive the outgoing data from the reconfigurable processor unit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem","description":"A mobile Internet-of-Things (IoT) edge device, comprising a reconfigurable processor unit including a substrate; a die stack coupled to the substrate and having a field-programmable gate array (FPGA) ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11463524","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11463524","citation_suggestion":"Patentable. \"Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem\" (US-11463524). https://patentable.app/patents/US-11463524","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11463524","json":"https://patentable.app/api/llm-context/US-11463524","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:36:56.410Z"}