{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11465224","patent":{"patent_number":"US-11465224","title":"Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods","assignee":null,"inventors":[],"filing_date":"2021-06-16T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":30,"abstract":"An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods","description":"An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a co","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11465224","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11465224","citation_suggestion":"Patentable. \"Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods\" (US-11465224). https://patentable.app/patents/US-11465224","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11465224","json":"https://patentable.app/api/llm-context/US-11465224","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:57:52.215Z"}