{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469120","patent":{"patent_number":"US-11469120","title":"Device and method for attaching protective tape to semiconductor wafer","assignee":null,"inventors":[],"filing_date":"2018-04-24T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Device and method for attaching protective tape to semiconductor wafer","description":"To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective ta","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469120","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469120","citation_suggestion":"Patentable. \"Device and method for attaching protective tape to semiconductor wafer\" (US-11469120). https://patentable.app/patents/US-11469120","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469120","json":"https://patentable.app/api/llm-context/US-11469120","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:05:05.010Z"}