{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469161","patent":{"patent_number":"US-11469161","title":"Lead frame-based semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-08-27T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"A semiconductor package includes: a lead frame having a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing; a first semiconductor die attached to a first group of the blocks; electrical conductors connecting a plurality of input/output (I/O) terminals of the first semiconductor die to a second group of the blocks, at least some blocks of the second group being laterally spaced outward from the blocks of the first group; and a mold compound encapsulating the first semiconductor die and the electrical conductors. Corresponding methods of producing the semiconductor package are also described."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Lead frame-based semiconductor package","description":"A semiconductor package includes: a lead frame having a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing; a first semiconductor die attached to a fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469161","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469161","citation_suggestion":"Patentable. \"Lead frame-based semiconductor package\" (US-11469161). https://patentable.app/patents/US-11469161","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469161","json":"https://patentable.app/api/llm-context/US-11469161","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T20:29:51.059Z"}