{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469164","patent":{"patent_number":"US-11469164","title":"Space efficient and low parasitic half bridge","assignee":null,"inventors":[],"filing_date":"2020-01-16T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A packaged half-bridge circuit includes a carrier having a dielectric core and a first layer of metallization formed on an upper surface of the carrier, first and second semiconductor chips, each including a first terminal, a second terminal, and a control terminal, and a conductive connector mounted on the upper surface of the carrier and electrically connected to the first layer of metallization. The first semiconductor chip is configured as a high-side switch of the half-bridge circuit. The second semiconductor chip is configured as a low-side switch of the half-bridge circuit. At least one of the first and second semiconductor chips is embedded within the dielectric core of the carrier. The conductive connector is electrically connected to one of the first and second terminals from one or both of the first and second semiconductor chips."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Space efficient and low parasitic half bridge","description":"A packaged half-bridge circuit includes a carrier having a dielectric core and a first layer of metallization formed on an upper surface of the carrier, first and second semiconductor chips, each incl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469164","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469164","citation_suggestion":"Patentable. \"Space efficient and low parasitic half bridge\" (US-11469164). https://patentable.app/patents/US-11469164","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469164","json":"https://patentable.app/api/llm-context/US-11469164","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:34:08.651Z"}