{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469170","patent":{"patent_number":"US-11469170","title":"Multilevel interconnection structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2020-09-11T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a substrate, an active region, an isolation structure, a first metal line, gate structure, source/drain region, a source/drain contact, and a second metal line. The active region protrudes from a top surface of the substrate. The isolation structure is over the substrate and laterally surrounds the active region. The first metal line is in the isolation structure. The gate structure is over the active region. The source/drain region is in the active region. The source/drain contact is over the active region and is electrically connected to the source/drain region. The second metal line is over the gate structure and the source/drain contact, in which the second metal line vertically overlaps the first metal line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilevel interconnection structure and method for forming the same","description":"A semiconductor device includes a substrate, an active region, an isolation structure, a first metal line, gate structure, source/drain region, a source/drain contact, and a second metal line. The act","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469170","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469170","citation_suggestion":"Patentable. \"Multilevel interconnection structure and method for forming the same\" (US-11469170). https://patentable.app/patents/US-11469170","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469170","json":"https://patentable.app/api/llm-context/US-11469170","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:50:45.006Z"}