{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469173","patent":{"patent_number":"US-11469173","title":"Method of manufacturing a semiconductor structure","assignee":null,"inventors":[],"filing_date":"2021-01-25T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"The present disclosure relates to a method of manufacturing a semiconductor structure. The method of manufacturing a semiconductor structure includes providing a carrier; disposing a dielectric layer over the carrier; removing a first portion of the dielectric layer to form an opening extending through the dielectric layer; removing a second portion of the dielectric layer to form a trench extending through and along the dielectric layer; disposing a conductive material into the opening and the trench to form a conductive via and a metallic strip, respectively; removing a third portion of the dielectric layer; detaching the dielectric layer from the carrier; disposing the dielectric layer over a substrate; disposing a die over the substrate; and forming a molding to surround the die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing a semiconductor structure","description":"The present disclosure relates to a method of manufacturing a semiconductor structure. The method of manufacturing a semiconductor structure includes providing a carrier; disposing a dielectric layer ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469173","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469173","citation_suggestion":"Patentable. \"Method of manufacturing a semiconductor structure\" (US-11469173). https://patentable.app/patents/US-11469173","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469173","json":"https://patentable.app/api/llm-context/US-11469173","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:28:26.492Z"}