{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469183","patent":{"patent_number":"US-11469183","title":"Multirow semiconductor chip connections","assignee":null,"inventors":[],"filing_date":"2020-12-15T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacturing a semiconductor device includes mounting an interconnect chip to a redistribution layer structure and mounting a first, second, and third semiconductor chip to the redistribution layer structure, where the second semiconductor chip is interposed between the first and the third semiconductor chips, and the interconnect chip communicatively couples the first, second and third, semiconductor chips to one another."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multirow semiconductor chip connections","description":"A method of manufacturing a semiconductor device includes mounting an interconnect chip to a redistribution layer structure and mounting a first, second, and third semiconductor chip to the redistribu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469183","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469183","citation_suggestion":"Patentable. \"Multirow semiconductor chip connections\" (US-11469183). https://patentable.app/patents/US-11469183","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469183","json":"https://patentable.app/api/llm-context/US-11469183","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:06:00.623Z"}