{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469188","patent":{"patent_number":"US-11469188","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-01-29T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package may include a package substrate, a molded interposer package (MIP) and a first stiffener. The MIP may be arranged on the package substrate. The MIP may include an interposer, at least one first semiconductor chip and at least one second semiconductor chip molded by a molding member. The first stiffener may be attached to any one of outer surfaces of the MIP. The first stiffener may be spaced apart from the upper surface of the package substrate to suppress a warpage of the MIP. Thus, central conductive bumps between the MIP and the package substrate may not be upwardly floated to improve an electrical connection between the central conductive bumps and the package substrate. Further, a short between edge conductive bumps between the MIP and the package substrate may not be generated."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package may include a package substrate, a molded interposer package (MIP) and a first stiffener. The MIP may be arranged on the package substrate. The MIP may include an interposer, a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469188","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469188","citation_suggestion":"Patentable. \"Semiconductor package\" (US-11469188). https://patentable.app/patents/US-11469188","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469188","json":"https://patentable.app/api/llm-context/US-11469188","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:14:35.141Z"}