{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469196","patent":{"patent_number":"US-11469196","title":"Semiconductor package including semiconductor chip having point symmetric chip pads","assignee":null,"inventors":[],"filing_date":"2020-07-28T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package according to an aspect of the present disclosure includes a package substrate and a plurality of semiconductor chips stacked on the package substrate. Each of the semiconductor chips includes a chip body, at least one first side power pad and at least one first side ground pad that are disposed on a first side portion on one surface of the chip body, and at least one second side power pad and at least one second side ground pad that are disposed on a second side portion opposite to the first side portion on one surface of the chip body. One of the second side power pads is disposed point-symmetrically to corresponding one of the first side power pads with respect to a reference point on the one surface, and one of the second side ground pads is disposed point-symmetrically to corresponding one of the first side ground pads with respect to a reference point on the one surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including semiconductor chip having point symmetric chip pads","description":"A semiconductor package according to an aspect of the present disclosure includes a package substrate and a plurality of semiconductor chips stacked on the package substrate. Each of the semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469196","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469196","citation_suggestion":"Patentable. \"Semiconductor package including semiconductor chip having point symmetric chip pads\" (US-11469196). https://patentable.app/patents/US-11469196","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469196","json":"https://patentable.app/api/llm-context/US-11469196","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:19:17.241Z"}