{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11469219","patent":{"patent_number":"US-11469219","title":"Dual die semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2021-04-28T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present application provides a semiconductor package and a manufacturing method for the semiconductor package. The semiconductor package includes a package substrate, a first semiconductor die, a second semiconductor die, a first encapsulant and a second encapsulant. The package substrate has a first side and a second side facing away from the first side, and the second side has a concave recessed from a planar portion of the second side. The first semiconductor die is attached to the first side of the package substrate. The second semiconductor die is attached to a recessed surface of the concave. The first encapsulant covers the first side of the package substrate and encapsulates the first semiconductor die. The second encapsulant fills up the concave and encapsulates the second semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Dual die semiconductor package and manufacturing method thereof","description":"The present application provides a semiconductor package and a manufacturing method for the semiconductor package. The semiconductor package includes a package substrate, a first semiconductor die, a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11469219","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11469219","citation_suggestion":"Patentable. \"Dual die semiconductor package and manufacturing method thereof\" (US-11469219). https://patentable.app/patents/US-11469219","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11469219","json":"https://patentable.app/api/llm-context/US-11469219","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:38:31.995Z"}