{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11470715","patent":{"patent_number":"US-11470715","title":"Embedded component structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-09-01T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded component structure and manufacturing method thereof","description":"An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11470715","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11470715","citation_suggestion":"Patentable. \"Embedded component structure and manufacturing method thereof\" (US-11470715). https://patentable.app/patents/US-11470715","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11470715","json":"https://patentable.app/api/llm-context/US-11470715","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:23:19.837Z"}