{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11470717","patent":{"patent_number":"US-11470717","title":"Stress relief encapsulation for flexible hybrid electronics","assignee":null,"inventors":[],"filing_date":"2021-02-17T00:00:00.000Z","publication_date":"2022-10-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stress relief encapsulation for flexible hybrid electronics","description":"Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with interme","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11470717","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11470717","citation_suggestion":"Patentable. \"Stress relief encapsulation for flexible hybrid electronics\" (US-11470717). https://patentable.app/patents/US-11470717","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11470717","json":"https://patentable.app/api/llm-context/US-11470717","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:23:25.421Z"}