{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11471997","patent":{"patent_number":"US-11471997","title":"Polishing pad, polishing apparatus and a method for polishing silicon wafer","assignee":null,"inventors":[],"filing_date":"2020-12-29T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":4,"abstract":"The present invention provides a polishing pad, a polishing apparatus and a polishing method for a silicon wafer. The polishing pad comprises a polishing surface in contact with the silicon wafer. The polishing surface is provided with at least one groove. When polishing the silicon wafer, the edge of the silicon wafer is at least partially suspended above the groove. The polishing pad, polishing apparatus and silicon wafer polishing method according to the present invention can reduce the polishing rate at the edge of the silicon wafer while keeping the polishing rate of the entire wafer basically unchanged, thereby improving the flatness of the edge thickness of the silicon wafer as well as improving the production yield."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Polishing pad, polishing apparatus and a method for polishing silicon wafer","description":"The present invention provides a polishing pad, a polishing apparatus and a polishing method for a silicon wafer. The polishing pad comprises a polishing surface in contact with the silicon wafer. The","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11471997","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11471997","citation_suggestion":"Patentable. \"Polishing pad, polishing apparatus and a method for polishing silicon wafer\" (US-11471997). https://patentable.app/patents/US-11471997","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11471997","json":"https://patentable.app/api/llm-context/US-11471997","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:31:07.315Z"}