{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11472957","patent":{"patent_number":"US-11472957","title":"Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module","assignee":null,"inventors":[],"filing_date":"2017-10-23T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":18,"abstract":"Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module","description":"Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11472957","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11472957","citation_suggestion":"Patentable. \"Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module\" (US-11472957). https://patentable.app/patents/US-11472957","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11472957","json":"https://patentable.app/api/llm-context/US-11472957","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:16:03.797Z"}