{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476169","patent":{"patent_number":"US-11476169","title":"Semiconductor chips including through electrodes and methods of testing the through electrodes","assignee":null,"inventors":[],"filing_date":"2021-05-28T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","G11C","G11C","G11C","H01L"],"num_claims":13,"abstract":"A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked over the first semiconductor device. The second semiconductor device is electrically connected to the first semiconductor device via a plurality of through electrodes. In a test mode, the first semiconductor device is configured to drive a first pattern of logic levels and a second pattern of logic levels through the plurality of through electrodes, configured to compare logic levels of a plurality of test data generated by the first and second patterns from the first and second semiconductor devices to generate a detection signal indicating that the plurality of through electrodes operated normally or abnormally."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chips including through electrodes and methods of testing the through electrodes","description":"A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked over the first semiconductor device. The second semiconductor device is electrically connected to t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476169","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476169","citation_suggestion":"Patentable. \"Semiconductor chips including through electrodes and methods of testing the through electrodes\" (US-11476169). https://patentable.app/patents/US-11476169","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476169","json":"https://patentable.app/api/llm-context/US-11476169","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:49:34.168Z"}