{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476174","patent":{"patent_number":"US-11476174","title":"Solder mask design for delamination prevention","assignee":null,"inventors":[],"filing_date":"2018-10-31T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Embodiments described herein provide techniques for forming a solder mask having a repeating pattern of features formed therein. The repeating pattern of features can be conceptually understood as a plurality of groove structures formed in the solder mask. The solder mask can be included in a semiconductor package that comprises the solder mask over a substrate and a molding compound over the solder mask that conforms to the repeating pattern of features. Several advantages are attributable to embodiments of the solder mask described herein. One advantage is that the repeating pattern of features formed in the solder mask increase the contact area between the solder mask and the molding compound. Increasing the contact area can assist with increasing adherence and conformance of the molding compound to the solder mask. This increased adherence and conformance assists with minimizing or eliminating interfacial delamination."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder mask design for delamination prevention","description":"Embodiments described herein provide techniques for forming a solder mask having a repeating pattern of features formed therein. The repeating pattern of features can be conceptually understood as a p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476174","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476174","citation_suggestion":"Patentable. \"Solder mask design for delamination prevention\" (US-11476174). https://patentable.app/patents/US-11476174","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476174","json":"https://patentable.app/api/llm-context/US-11476174","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:58:32.500Z"}