{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476197","patent":{"patent_number":"US-11476197","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2020-06-08T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present invention provides a semiconductor device for reducing parasitic inductance.The semiconductor device of the present invention includes: a semiconductor chip, including a front surface and a hack surface, and including a source pad, a drain pad and a gate pad on the front surface; a die pad, disposed under the semiconductor chip and bonded to the hack surface of the semiconductor chip; a source lead, electrically connected to the die pad; a drain lead and a gate lead, disposed on a periphery of the die pad; and a sealing resin, sealing the semiconductor chip, the die pad and each of the leads. At least one via for external connection is formed in the semiconductor chip to connect to the source pad, and the via for external connection is disposed on a circumferential portion of the semiconductor chip in perspective view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device","description":"The present invention provides a semiconductor device for reducing parasitic inductance.The semiconductor device of the present invention includes: a semiconductor chip, including a front surface and ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476197","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476197","citation_suggestion":"Patentable. \"Semiconductor device\" (US-11476197). https://patentable.app/patents/US-11476197","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476197","json":"https://patentable.app/api/llm-context/US-11476197","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:47:40.093Z"}