{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476205","patent":{"patent_number":"US-11476205","title":"Package structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2021-02-09T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure. The first stacked die package structure includes a plurality of memory dies. The underfill layer is over the first stacked die package structure. The underfill layer includes a first protruding portion that extends below a top surface of the through substrate via structure. The package layer is over the underfill layer. The package layer has a second protruding portion that extends below the top surface of the through substrate via structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method for forming the same","description":"A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476205","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476205","citation_suggestion":"Patentable. \"Package structure and method for forming the same\" (US-11476205). https://patentable.app/patents/US-11476205","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476205","json":"https://patentable.app/api/llm-context/US-11476205","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:45:51.517Z"}