{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476210","patent":{"patent_number":"US-11476210","title":"Semiconductor device and semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-09-03T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A semiconductor device includes: a first semiconductor chip having a first pad and a second pad, a depression being formed in the second pad; an organic insulating film provided on the first semiconductor chip, the organic insulating film covering the depression and not covering at least a portion of the first pad; and a redistribution layer having a lower portion connected to the first pad and an upper portion disposed on the organic insulating film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and semiconductor package","description":"A semiconductor device includes: a first semiconductor chip having a first pad and a second pad, a depression being formed in the second pad; an organic insulating film provided on the first semicondu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476210","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476210","citation_suggestion":"Patentable. \"Semiconductor device and semiconductor package\" (US-11476210). https://patentable.app/patents/US-11476210","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476210","json":"https://patentable.app/api/llm-context/US-11476210","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:22:17.731Z"}