{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476224","patent":{"patent_number":"US-11476224","title":"Wiring member and semiconductor module including same","assignee":null,"inventors":[],"filing_date":"2018-05-08T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring member and semiconductor module including same","description":"In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a thr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476224","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476224","citation_suggestion":"Patentable. \"Wiring member and semiconductor module including same\" (US-11476224). https://patentable.app/patents/US-11476224","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476224","json":"https://patentable.app/api/llm-context/US-11476224","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:15:32.426Z"}