{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11476293","patent":{"patent_number":"US-11476293","title":"Manufacturing method of chip package","assignee":null,"inventors":[],"filing_date":"2020-11-17T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A manufacturing method of a chip package includes forming a temporary bonding layer on a carrier; forming an encapsulation layer on a top surface of a wafer or on the temporary bonding layer; bonding the carrier to the wafer, in which the encapsulation layer covers a sensor and a conductive pad of the wafer; patterning a bottom surface of the wafer to form a through hole, in which the conductive pad is exposed through the through hole; forming an isolation layer on the bottom surface of the wafer and a sidewall of the through hole; forming a redistribution layer on the isolation layer and the conductive pad that is in the through hole; forming a passivation layer on the isolation layer and the redistribution layer; and removing the temporary bonding layer and the carrier."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of chip package","description":"A manufacturing method of a chip package includes forming a temporary bonding layer on a carrier; forming an encapsulation layer on a top surface of a wafer or on the temporary bonding layer; bonding ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11476293","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11476293","citation_suggestion":"Patentable. \"Manufacturing method of chip package\" (US-11476293). https://patentable.app/patents/US-11476293","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11476293","json":"https://patentable.app/api/llm-context/US-11476293","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:46:32.155Z"}