{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11477354","patent":{"patent_number":"US-11477354","title":"Camera module and molded circuit board assembly and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-04-08T00:00:00.000Z","publication_date":"2022-10-18T00:00:00.000Z","cpc_codes":["H04N","H04N","H04N"],"num_claims":13,"abstract":"A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Camera module and molded circuit board assembly and manufacturing method thereof","description":"A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed wit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11477354","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11477354","citation_suggestion":"Patentable. \"Camera module and molded circuit board assembly and manufacturing method thereof\" (US-11477354). https://patentable.app/patents/US-11477354","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11477354","json":"https://patentable.app/api/llm-context/US-11477354","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:50:32.977Z"}