{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11478654","patent":{"patent_number":"US-11478654","title":"Packaging structure and packaging method for retinal prosthesis implanted chip","assignee":null,"inventors":[],"filing_date":"2018-05-16T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["A61N","H01L","A61N","A61N","A61N","H01L","H01L","H01L"],"num_claims":6,"abstract":"The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimulation electrode component processed by a glass substrate, wherein the stimulation electrode component comprises the glass substrate, and a plurality of stimulation electrodes and a pad structure provided on the glass substrate; the stimulation electrodes are formed through cutting out metal pins on the metal and then pouring with glass; the stimulation electrode component is connected to an ASIC chip; a glass packaging cover is covered on the ASIC chip, the glass packaging cover is provided with a metal feedthrough structure for communicating with the stimulation chip; and the packaging cover covers and encapsulates the pad structure. In the packaging structure of the present invention, the substrate and the packaging cover are both made of a glass material, and thereby enable manufacture of a high-density stimulation electrode array, and the metal feedthrough structure is directly used on the glass cover, which facilitates wiring and achieves good sealing performance of the package cover."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging structure and packaging method for retinal prosthesis implanted chip","description":"The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimul","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11478654","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11478654","citation_suggestion":"Patentable. \"Packaging structure and packaging method for retinal prosthesis implanted chip\" (US-11478654). https://patentable.app/patents/US-11478654","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11478654","json":"https://patentable.app/api/llm-context/US-11478654","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:21:08.039Z"}