{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482272","patent":{"patent_number":"US-11482272","title":"Power supply system and semiconductor package assembly","assignee":null,"inventors":[],"filing_date":"2021-03-24T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["G11C","G11C","G11C","G11C","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic device and a semiconductor package structure are provided. The device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The semiconductor dies are stacked over the power supply system. The power supply system includes: a voltage generating circuit configured to generate at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies through a power interconnecting structure. The semiconductor package structure includes a package substrate; at least one semiconductor die disposed on the package substrate; and the power supply system disposed on the package substrate. The at least one semiconductor die may include a plurality of semiconductor dies vertically stacked on the package substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power supply system and semiconductor package assembly","description":"An electronic device and a semiconductor package structure are provided. The device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The semicon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482272","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482272","citation_suggestion":"Patentable. \"Power supply system and semiconductor package assembly\" (US-11482272). https://patentable.app/patents/US-11482272","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482272","json":"https://patentable.app/api/llm-context/US-11482272","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:34:14.400Z"}