{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482407","patent":{"patent_number":"US-11482407","title":"Wafer grinding method","assignee":null,"inventors":[],"filing_date":"2020-09-03T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":3,"abstract":"There is provided a wafer grinding method of grinding a wafer having an orientation flat for indicating a crystal orientation in the condition where the wafer is held on a holding surface of a chuck table. The chuck table includes a suction holding portion for holding the wafer under suction and a frame portion surrounding the suction holding portion. The suction holding portion has a first cutout portion corresponding to the orientation flat, and the frame portion has a second cutout portion formed along the first cutout portion. The wafer grinding method includes a holding surface grinding step of grinding the holding surface by using abrasive members of a grinding wheel, and a wafer grinding step of grinding the wafer by using the abrasive members in the condition where the wafer is held on the holding surface ground by the abrasive members."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer grinding method","description":"There is provided a wafer grinding method of grinding a wafer having an orientation flat for indicating a crystal orientation in the condition where the wafer is held on a holding surface of a chuck t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482407","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482407","citation_suggestion":"Patentable. \"Wafer grinding method\" (US-11482407). https://patentable.app/patents/US-11482407","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482407","json":"https://patentable.app/api/llm-context/US-11482407","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:24:26.287Z"}