{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482451","patent":{"patent_number":"US-11482451","title":"Interconnect structures","assignee":null,"inventors":[],"filing_date":"2020-11-20T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes receiving an integrated circuit (IC) layout having a plurality of metal features in a metal layer. The method also includes classifying the plurality of metal features into a first type of metal features and a second type of metal features based on a dimensional criterion, where the first type of the metal features have dimensions greater than the second type of the metal features. The method further includes assigning to the first type of metal features a first metal material, and to the second type of metal features a second metal material, where the second metal material is different from the first metal material. The method additionally includes forming the plurality of metal features embedded within a dielectric layer, where each of the plurality of metal features have the respective assigned metal materials."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structures","description":"A method includes receiving an integrated circuit (IC) layout having a plurality of metal features in a metal layer. The method also includes classifying the plurality of metal features into a first t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482451","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482451","citation_suggestion":"Patentable. \"Interconnect structures\" (US-11482451). https://patentable.app/patents/US-11482451","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482451","json":"https://patentable.app/api/llm-context/US-11482451","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:40:52.384Z"}