{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482463","patent":{"patent_number":"US-11482463","title":"Vertically attaching a chip to a substrate","assignee":null,"inventors":[],"filing_date":"2020-05-20T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Provided is a semiconductor package modularized and manufactured by preparing a main block for putting on a semiconductor chip, an insulator, and one or more sub block, preparing the semiconductor chip, preparing an adhesive used in attaching the semiconductor chip, attaching the semiconductor chip to an upper surface or upper and lower surfaces of the main block, performing an electrical connection of the semiconductor chip, preparing a substrate comprising a pattern enabling an electrical connection and vertically attaching one side of the main block to the pattern of the substrate to enable an electrical connection. In the semiconductor package above, an accumulation rate increases on the substrate due to a vertically arranged structure of the semiconductor chips and a heat emission area is enlarged to improve a heat emission effect."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Vertically attaching a chip to a substrate","description":"Provided is a semiconductor package modularized and manufactured by preparing a main block for putting on a semiconductor chip, an insulator, and one or more sub block, preparing the semiconductor chi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482463","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482463","citation_suggestion":"Patentable. \"Vertically attaching a chip to a substrate\" (US-11482463). https://patentable.app/patents/US-11482463","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482463","json":"https://patentable.app/api/llm-context/US-11482463","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:00:45.931Z"}