{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482478","patent":{"patent_number":"US-11482478","title":"Shielded electronic package and method of fabrication","assignee":null,"inventors":[],"filing_date":"2020-07-23T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Shielded electronic package and method of fabrication","description":"An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that inclu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482478","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482478","citation_suggestion":"Patentable. \"Shielded electronic package and method of fabrication\" (US-11482478). https://patentable.app/patents/US-11482478","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482478","json":"https://patentable.app/api/llm-context/US-11482478","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:43:08.308Z"}