{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482480","patent":{"patent_number":"US-11482480","title":"Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate","assignee":null,"inventors":[],"filing_date":"2020-03-19T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, an optically-cured dielectric layer, a plurality of block layers and a sacrificial layer. The circuit layer includes a plurality of conductive pads. The optically-cured dielectric layer has an upper surface and a lower surface opposite to the upper surface. The optically-cured dielectric layer covers the circuit layer, and first surfaces of the conductive pads are at least partially exposed from the upper surface of the optically-cured dielectric layer. The block layers are respectively disposed on the first surfaces of the conductive pads exposed by the optically-cured dielectric layer. The sacrificial layer is disposed on the optically-cured dielectric layer and covering the block layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate","description":"A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, an optically-cured dielectric layer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482480","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482480","citation_suggestion":"Patentable. \"Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate\" (US-11482480). https://patentable.app/patents/US-11482480","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482480","json":"https://patentable.app/api/llm-context/US-11482480","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:18:54.465Z"}