{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11482514","patent":{"patent_number":"US-11482514","title":"Semiconductor storage device including first pads on a first chip that are bonded to second pads on a second chip","assignee":null,"inventors":[],"filing_date":"2020-02-27T00:00:00.000Z","publication_date":"2022-10-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor storage device includes first and second chips. The first chip includes memory cells provided on a first substrate in a memory cell region, a plurality of first pads provided on a first surface of the first substrate and disposed in an edge region of the first chip that surrounds the memory cell region, and a first conductive layer provided on the first substrate and electrically connected to the first pads. The second chip includes a first circuit provided on a second substrate in a circuit region, a plurality of second pads provided on the second substrate and disposed in an edge region of the second chip that surrounds the circuit region, and a second conductive layer provided on the second substrate and electrically connected to the second pads. The first pads of the first chip and the second pads of the second chip are bonded facing each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor storage device including first pads on a first chip that are bonded to second pads on a second chip","description":"A semiconductor storage device includes first and second chips. The first chip includes memory cells provided on a first substrate in a memory cell region, a plurality of first pads provided on a firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11482514","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11482514","citation_suggestion":"Patentable. \"Semiconductor storage device including first pads on a first chip that are bonded to second pads on a second chip\" (US-11482514). https://patentable.app/patents/US-11482514","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11482514","json":"https://patentable.app/api/llm-context/US-11482514","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:33:31.920Z"}