{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11486834","patent":{"patent_number":"US-11486834","title":"Substrate inspection method and method of fabricating a semiconductor device using the same","assignee":null,"inventors":[],"filing_date":"2019-12-10T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["G01N","G01N","G01N","G01N","G01N","G01N","G01N","H01L","G01N","G01N","G01N","G01N"],"num_claims":20,"abstract":"Disclosed are a substrate inspection method and a method of fabricating a semiconductor device using the same. The inspection method may include measuring a target area of a substrate using a pulsed beam to obtain a first peak, measuring a near field ultrasound, which is produced by the pulsed beam in a near field region including the target area, using a first continuous wave beam different from the pulsed beam to obtain a second peak, and measuring a far field ultrasound, which is produced by the near field ultrasound in a far field region outside the near field region, using a second continuous wave beam to examine material characteristics of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate inspection method and method of fabricating a semiconductor device using the same","description":"Disclosed are a substrate inspection method and a method of fabricating a semiconductor device using the same. The inspection method may include measuring a target area of a substrate using a pulsed b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11486834","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11486834","citation_suggestion":"Patentable. \"Substrate inspection method and method of fabricating a semiconductor device using the same\" (US-11486834). https://patentable.app/patents/US-11486834","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11486834","json":"https://patentable.app/api/llm-context/US-11486834","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:37:52.178Z"}