{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488832","patent":{"patent_number":"US-11488832","title":"Method and apparatus for final polishing of silicon wafer","assignee":null,"inventors":[],"filing_date":"2019-12-25T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":16,"abstract":"Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing includes: within a predetermined period of time remaining before completion of the final polishing, forming a hydrophilic silicon oxide film on a surface of the silicon wafer by using both a polishing slurry and an oxidizing solution as a polishing liquid."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for final polishing of silicon wafer","description":"Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing includes: within a predetermined period of time remaining before completion of the final poli","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488832","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488832","citation_suggestion":"Patentable. \"Method and apparatus for final polishing of silicon wafer\" (US-11488832). https://patentable.app/patents/US-11488832","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488832","json":"https://patentable.app/api/llm-context/US-11488832","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:30:21.554Z"}