{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488840","patent":{"patent_number":"US-11488840","title":"Wafer-to-wafer interconnection structure and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2021-01-11T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A method of manufacturing a wafer-to-wafer interconnection structure includes forming a first etching stop layer with at least two portions on a first surface of a first substrate, and forming a void in one portion of the first etching stop layer. A second etching stop layer is formed on a first surface of a second substrate, and then the first surfaces of the first substrate and the second substrate are bonded, wherein the second etching stop layer is aligned to the void. By using the first and the second etching stop layers as etching stop layers, a first opening is formed from a second surface of the first substrate into the first substrate, and a second opening is formed through the void to the second substrate. A first TSV (through silicon via) is formed in the first opening, and a second TSV is formed in the second opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer-to-wafer interconnection structure and method of manufacturing the same","description":"A method of manufacturing a wafer-to-wafer interconnection structure includes forming a first etching stop layer with at least two portions on a first surface of a first substrate, and forming a void ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488840","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488840","citation_suggestion":"Patentable. \"Wafer-to-wafer interconnection structure and method of manufacturing the same\" (US-11488840). https://patentable.app/patents/US-11488840","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488840","json":"https://patentable.app/api/llm-context/US-11488840","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:51:57.331Z"}