{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488864","patent":{"patent_number":"US-11488864","title":"Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia","assignee":null,"inventors":[],"filing_date":"2021-01-15T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor device structure includes: at least one inter-metal layer stacked in a vertical direction; and a 1st via structure penetrating the at least one inter-metal layer, wherein, in the at least one inter-metal layer, a 1st vertical side of the 1st via structure does not contact a barrier metal pattern while a 2nd vertical side of the 1st via structure opposite to the 1st vertical side of the 1st via structure contacts the barrier metal pattern."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia","description":"A semiconductor device structure includes: at least one inter-metal layer stacked in a vertical direction; and a 1st via structure penetrating the at least one inter-metal layer, wherein, in the at le","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488864","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488864","citation_suggestion":"Patentable. \"Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia\" (US-11488864). https://patentable.app/patents/US-11488864","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488864","json":"https://patentable.app/api/llm-context/US-11488864","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:25:11.950Z"}