{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488866","patent":{"patent_number":"US-11488866","title":"Package substrate dividing method","assignee":null,"inventors":[],"filing_date":"2019-11-21T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":12,"abstract":"A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing layer formed on the back side, in which devices are sealed. The method includes a groove forming step of forming a groove along each division line on the mount surface of the package substrate so that the groove has a depth corresponding to a finished thickness of each device package, a burr removing step of removing burrs produced from electrodes in the groove forming step, and a grinding step of grinding the sealing layer of the package substrate so that a thickness of the package substrate is reduced to the finished thickness, after performing the burr removing step, thereby dividing the package substrate into the plural device packages."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate dividing method","description":"A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488866","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488866","citation_suggestion":"Patentable. \"Package substrate dividing method\" (US-11488866). https://patentable.app/patents/US-11488866","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488866","json":"https://patentable.app/api/llm-context/US-11488866","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:16:29.578Z"}