{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488917","patent":{"patent_number":"US-11488917","title":"Semiconductor structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2022-01-19T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a first chip and a second chip. A first conductive connection wire of the first chip is connected to a first conductive contact pad, and a second conductive connection wire of the second chip is connected to a second conductive contact pad. In addition, the first conductive contact pad includes a first conductor and a second conductor, and the second conductive contact pad includes a third conductor and a fourth conductor. The first conductor is directly opposite to the fourth conductor, and the second conductor is directly opposite to the third conductor. Therefore, pre-connection of the first conductive contact pad and the second conductive contact pad may be implemented and then the first chip and second chip that are pre-connected are transferred for bonding."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor structure and manufacturing method thereof","description":"The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a first chip and a second chip. A first conductive connection wire of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488917","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488917","citation_suggestion":"Patentable. \"Semiconductor structure and manufacturing method thereof\" (US-11488917). https://patentable.app/patents/US-11488917","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488917","json":"https://patentable.app/api/llm-context/US-11488917","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:41:57.157Z"}