{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488939","patent":{"patent_number":"US-11488939","title":"3D semiconductor devices and structures with at least one vertical bus","assignee":null,"inventors":[],"filing_date":"2022-01-24T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A 3D device comprising: a first level comprising first transistors, said first level comprising a first interconnect; a second level comprising second transistors, said second level overlaying said first level; a third level comprising third transistors, said third level overlaying said second level; a plurality of electronic circuit units (ECUs), wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors, wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors, wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors, wherein each of said ECUs comprises a vertical bus, wherein said vertical bus comprises greater than eight pillars and less than three hundred pillars and provides electrical connections between said first circuit and said second circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"3D semiconductor devices and structures with at least one vertical bus","description":"A 3D device comprising: a first level comprising first transistors, said first level comprising a first interconnect; a second level comprising second transistors, said second level overlaying said fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488939","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488939","citation_suggestion":"Patentable. \"3D semiconductor devices and structures with at least one vertical bus\" (US-11488939). https://patentable.app/patents/US-11488939","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488939","json":"https://patentable.app/api/llm-context/US-11488939","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:19:55.108Z"}