{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11488945","patent":{"patent_number":"US-11488945","title":"3D stacked integrated circuits having functional blocks configured to provide redundancy sites","assignee":null,"inventors":[],"filing_date":"2021-03-31T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","G06F","G06F","G06F","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"3D stacked integrated circuits having functional blocks configured to provide redundancy sites","description":"A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11488945","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11488945","citation_suggestion":"Patentable. \"3D stacked integrated circuits having functional blocks configured to provide redundancy sites\" (US-11488945). https://patentable.app/patents/US-11488945","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11488945","json":"https://patentable.app/api/llm-context/US-11488945","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:36:19.837Z"}