{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11489309","patent":{"patent_number":"US-11489309","title":"Form board preparation for wire bundling","assignee":null,"inventors":[],"filing_date":"2019-10-28T00:00:00.000Z","publication_date":"2022-11-01T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F"],"num_claims":20,"abstract":"Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Form board preparation for wire bundling","description":"Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11489309","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11489309","citation_suggestion":"Patentable. \"Form board preparation for wire bundling\" (US-11489309). https://patentable.app/patents/US-11489309","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11489309","json":"https://patentable.app/api/llm-context/US-11489309","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:15:55.726Z"}