{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11495531","patent":{"patent_number":"US-11495531","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-07-09T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a carrier, an electronic component, a first encapsulant and a conductive via. The carrier has a first surface and a second surface opposite to the first surface. The semiconductor device is mounted at the second surface of the carrier. The first encapsulant encapsulates the first surface of the carrier and has a surface facing away from the first surface of the carrier. The conductive via extends from the surface of the first encapsulant into the carrier."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a carrier, an electronic component, a first encap","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11495531","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11495531","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-11495531). https://patentable.app/patents/US-11495531","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11495531","json":"https://patentable.app/api/llm-context/US-11495531","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:34:57.779Z"}