{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11495538","patent":{"patent_number":"US-11495538","title":"Fully aligned via for interconnect","assignee":null,"inventors":[],"filing_date":"2020-07-18T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A fully aligned via interconnect structure and techniques for formation thereof using subtractive metal patterning are provided. In one aspect, an interconnect structure includes: metal lines Mx−1; metal lines Mx disposed over the metal lines Mx−1; and at least one via Vx−1 fully aligned between the metal lines Mx−1 and the metal lines Mx, wherein a top surface of at least one of the metal lines Mx−1 has a stepped profile. In another aspect, another interconnect structure includes: metal lines Mx−1; metal lines Mx disposed over the metal lines Mx−1; at least one via Vx−1 fully aligned between the metal lines Mx−1 and the metal lines Mx; and sidewall spacers alongside the metal lines Mx. A method of forming an interconnect structure is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fully aligned via for interconnect","description":"A fully aligned via interconnect structure and techniques for formation thereof using subtractive metal patterning are provided. In one aspect, an interconnect structure includes: metal lines Mx−1; me","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11495538","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11495538","citation_suggestion":"Patentable. \"Fully aligned via for interconnect\" (US-11495538). https://patentable.app/patents/US-11495538","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11495538","json":"https://patentable.app/api/llm-context/US-11495538","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:58:55.163Z"}