{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11495539","patent":{"patent_number":"US-11495539","title":"Interconnect structure with air-gaps","assignee":null,"inventors":[],"filing_date":"2021-01-08T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first interconnect wire arranged within an inter-level dielectric (ILD) layer and a second interconnect wire arranged within the ILD layer. A dielectric material continuously extends over the first interconnect wire and the ILD layer. The dielectric material is further disposed between sidewalls of the first interconnect wire and one or more air-gaps arranged along opposing sides of the first interconnect wire. A via is disposed over the second interconnect wire and extends through the dielectric material. A second ILD layer is disposed on the dielectric material and surrounds the via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure with air-gaps","description":"The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first interconnect wire arranged within an inter-level dielectric (ILD) layer and a second in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11495539","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11495539","citation_suggestion":"Patentable. \"Interconnect structure with air-gaps\" (US-11495539). https://patentable.app/patents/US-11495539","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11495539","json":"https://patentable.app/api/llm-context/US-11495539","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:18:41.346Z"}